Sensor Procurement & IoT Devices Execution Plan
A practical, phase-wise manufacturing roadmap detailing how FactoryVibe transitions from off-the-shelf rapid prototyping components to proprietary custom-engineered IP67 industrial sensor pods assembled in India.
Bill of Materials (BOM) & Sourcing Strategy
| Category | Component & Model | Technical Specification | Supplier / Procurement Channel | Est. Unit Cost |
|---|---|---|---|---|
| Compute & AI Module | NVIDIA Jetson Orin Nano System-on-Module (SOM) | 40 TOPS AI, 6-core Arm Cortex-A78AE, 8GB LPDDR5 | NVIDIA Authorized Distributor (Arrow / Avnet India) | ₹18,500 / unit |
| Acoustic Sensing | Industrial MEMS Ultrasonic Microphone Array | Frequency response 20Hz - 100kHz, High SNR 65dB | Knowles Electronics / TDK InvenSense (India Stockists) | ₹1,200 / unit |
| Thermal Imaging | FLIR Lepton 3.5 Long-Wave Infrared (LWIR) Core | 160x120 radiometric thermal resolution, SPI interface | Teledyne FLIR India / Digikey India | ₹14,000 / unit |
| Vibration & Accelerometer | Industrial 3-Axis High-Frequency Accelerometer | ±16g range, 10kHz bandwidth, SPI output | Analog Devices (ADXL356) / STMicroelectronics | ₹1,800 / unit |
| Enclosure & Mount | IP67 Die-Cast Aluminum & Neodymium Base | 80kg pull-force magnetic mount, thermal heatsink casing | Custom Tooling via Local CNC / Plastic Injection Manufacturer (Indore Industrial Zone) | ₹2,500 / unit |
| Power & Connectivity | Power Supply & Air-gapped Relay Block | 9V-36V Industrial DC input + 3000mAh backup LiFePO4 battery | MeanWell / local PCB Assembly partner | ₹1,500 / unit |
From Prototype Sourcing to Scale Manufacturing
Phase 1: Rapid Prototyping & Off-the-Shelf Assembly (Months 1-3)
Assemble initial 10 Prototype Pods using NVIDIA Jetson Developer Kits, FLIR Breakout boards, and 3D-printed enclosure prototypes for bench testing and initial plant demonstration.
Phase 2: Custom Carrier PCB Design & Enclosure Tooling (Months 4-6)
Design proprietary compact carrier PCB integrating power regulators, MEMS micro-phone array, and Jetson SOM connector. Commission aluminum die-cast tooling with Indore CNC partners.
Phase 3: SMT Production & Local Assembly Line (Months 7-12)
Partner with domestic EMS (Electronics Manufacturing Services) in India (e.g., Syrma SGS / Dixon / local MP EMS units) for SMT component placement, quality testing, and BIS certification.
Phase 4: Scaling & Automated Factory Deployment (Months 13-24)
Establish standardized 30-minute technician deployment workflow: Magnetic snap-on mount -> QR Code pairing -> Automatic baseline calibration via local Jetson AI engine.
Industrial Certification & Environmental Testing
Ensuring ruggedized operation in high-vibration, high-dust, and humid factory environments.
Dust & Water Ingress Protection
Die-cast aluminum casing with custom silicone gasket seals protecting sensitive MEMS mics and thermal camera optics against coolant spray and metal dust.
IEC 60068 Vibration Endurance
Internal PCB mounted on silicone mechanical dampeners to isolate board solder joints from continuous 10g high-amplitude heavy machine shockwaves.
Domestic BIS & CE Mark Compliance
Standardized power management circuitry designed for Bureau of Indian Standards (BIS) and CE compliance for immediate deployment across Indian and global plants.
Review Phased Execution & Investment Ask
See our 4-phase rollout timeline, 82% SaaS gross margin unit economics, and $150K pre-seed use of funds.